Press Welded Copper Foil Flexible Busbar Flexible

Press Welded Copper Foil Flexible Busbar: Comprehensive Technical Overview

The Press Welded Copper Foil Flexible Busbar represents a significant advancement in electrical conduction technology, combining the superior conductivity of copper with innovative manufacturing techniques. This specialized component has become indispensable in modern power distribution systems where flexibility, reliability, and high current capacity are paramount requirements.

Technical Characteristics and Performance Data

1. Material Composition

The busbar is constructed from 99.9% pure electrolytic copper (C11000), ensuring optimal electrical conductivity with a typical value of 58 MS/m at 20°C. The copper foil thickness ranges from 0.1mm to 0.5mm, with standard widths between 10mm to 200mm.

2. Press Welding Technology

The press welding process creates molecular bonds between copper layers without filler material, achieving a joint strength of ≥90% of base material strength. The welding temperature is precisely controlled at 500-600°C with pressures reaching 50-100 MPa.

3. Flexibility Parameters

The flexible design allows for ±30° angular movement and 5-10mm axial displacement while maintaining electrical continuity. The minimum bending radius is 5 times the busbar thickness for dynamic applications.

4. Electrical Performance

Current carrying capacity reaches 15-20 A/mm² in free air, with a temperature rise limited to ≤50K at rated current. The contact resistance is exceptionally low at ≤10 μΩ·cm.

5. Mechanical Properties

Tensile strength measures 220-250 MPa, with elongation at break of 15-25%. The Vickers hardness ranges from 80-100 HV.

6. Thermal Characteristics

The thermal conductivity is 385 W/(m·K), with a maximum continuous operating temperature of 105°C and short-term withstand capability up to 250°C.

7. Surface Treatment

Standard options include tin plating (3-8μm), silver plating (2-5μm), or nickel plating (5-10μm), providing corrosion resistance with salt spray test performance exceeding 96 hours.

Application Scenarios

Maintenance and Care Procedures

1. Installation Guidelines

• Maintain bending radius ≥ 5× thickness during installation

• Use torque-controlled fasteners at 5-10 N·m for terminal connections

• Ensure parallel alignment within ±0.5mm for multi-layer configurations

2. Operational Monitoring

• Measure temperature rise quarterly, maintaining ≤65°C above ambient

• Check contact resistance annually, with values ≤15 μΩ per joint

• Inspect for mechanical fatigue every 10,000 cycles in dynamic applications

3. Cleaning Procedures

• Use isopropyl alcohol (99.9%) for surface cleaning

• Apply NO-OX-ID A-Special compound for plated surfaces every 2 years

• Remove oxidation with 600-grit conductive abrasive when needed

4. Storage Conditions

• Maintain environment at 15-30°C and 40-60% RH

• Use vapor-corrosion inhibitor bags for periods > 3 months

• Store flat with ≤50mm overhang to prevent deformation

5. End-of-Life Indicators

• Replace when cracks exceed 10% of width

• Retire after 50,000 flex cycles or 20 years static service

• Discard if resistance increases by >20% from initial values

Advanced Technical Considerations

1. Electromagnetic Performance

The skin effect becomes significant at frequencies above 1kHz, with the 0.3mm foil thickness optimal for 50-400Hz applications. Proximity effect is minimized through ≥10mm spacing between parallel conductors.

2. Vibration Resistance

Withstands 5-2000Hz random vibration at 5Grms for 2 hours per MIL-STD-810G. Natural frequency is typically 80-120Hz for 100mm spans.

3. Thermal Cycling Endurance

Survives -40°C to +125°C thermal shock for 500 cycles with <2% resistance change. CTE matches PCB materials at 17 ppm/°C.